US Patent Issued to WINDBOND ELECTRONICS on Dec. 9 for "Semiconductor device and forming method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,548, issued on Dec. 9, was assigned to WINDBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor device and forming method thereof" was invented by Hung-Yu Wei (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided. The semiconductor device includes a substrate, a first source/drain region and a second source/drain region disposed within the substrate, and a gate structure disposed on the substrate and between the first source/drain region and the second source/drain region. The semiconductor device further includes an interlayer dielectric layer disposed over the first source/drain region, the second ...