US Patent Issued to WINBOND ELECTRONICS on Sept. 30 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,998, issued on Sept. 30, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor structure" was invented by Che-Jui Hsu (Taichung, Taiwan) and Ying-Fu Tung (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a pad layer, a first conductive layer, a second conductive layer, an interlayer dielectric layer, and a control gate. The pad layer is disposed on a substrate. The first conductive layer is disposed on the pad layer. The second conductive layer is disposed on the first conductive layer. The interlayer dielectric layer is disposed on the...