US Patent Issued to WINBOND ELECTRONICS on Sept. 2 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,320, issued on Sept. 2, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Tzu-Ming Ou Yang (Taichung, Taiwan), Chun-Chieh Wang (Taichung, Taiwan) and Shu-Ming Lee (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and its manufacturing method are provided. A semiconductor structure includes a substrate and several bit lines on the substrate. Each of the bit lines includes a first conductive layer on the substrate, a second conductive layer on the first conductive layer, and a hardmask layer on the second conductive layer...