US Patent Issued to WINBOND ELECTRONICS on Sept. 16 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,030, issued on Sept. 16, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Jiun-Sheng Yang (Taichung, Taiwan) and Yi-Chin Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first insulating layer over a substrate and a contact plug in the first insulating layer and in contact with the surface of the substrate. The semiconductor device further includes a capacitor structure above the contact plug and a second insulating layer on the first insulating layer and covering the capacitor structure. The capacitor stru...