US Patent Issued to WINBOND ELECTRONICS on Oct. 7 for "Method for forming semiconductor device that includes flash memory" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,004, issued on Oct. 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Method for forming semiconductor device that includes flash memory" was invented by Yu-Jen Huang (Taichung, Taiwan), Chu-Chun Hsieh (Taichung, Taiwan) and Hsiu-Han Liao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure is provided. The method includes providing a semiconductor substrate with a plurality of floating gates on it, and an isolation structure between the floating gates. The method includes performing a first etching process to recess the isolation structure and to form an opening between the fl...