US Patent Issued to Winbond Electronics on Nov. 11 for "Memory device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,277, issued on Nov. 11, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Memory device and method of manufacturing the same" was invented by Che-Fu Chuang (Taichung, Taiwan), Yao-Ting Tsai (Taichung, Taiwan) and Hsiu-Han Liao (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a memory device and a method of manufacturing the same. The memory device includes: a stack structure; a first source/drain region and a second source/drain region located in a substrate beside the stack structure; a first self-aligned contact connected to the first source/drain region; a second self-aligned contact connected to the seco...