US Patent Issued to WINBOND ELECTRONICS on May 13 for "Semiconductor structure including conductive layers contacting trench" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,612, issued on May 13, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor structure including conductive layers contacting trench" was invented by Yoshinori Tanaka (Taichung, Taiwan) and Wei-Che Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a trench, a first conductive layer, a second conductive layer, a third conductive layer, a source region and a drain region, a bit line contact, and a storage node contact. The trench is disposed in the substrate. The first conductive layer is disposed in the trench. The second conductive layer is disposed on a top ...