US Patent Issued to WINBOND ELECTRONICS on May 13 for "Semiconductor memory structure" (Taiwanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,546, issued on May 13, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor memory structure" was invented by Hao-Chuan Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory structure includes a semiconductor substrate, a bit line disposed on the semiconductor substrate, a dielectric liner disposed on a sidewall of the bit line and a capacitor contact disposed on a side of the bit line. The dielectric liner includes a first nitride liner disposed on a sidewall of the bit line, an oxide liner disposed on a sidewall of the first nitride liner, and a second nitride liner disposed on a side...