ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,528, issued on March 25, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).
"Manufacturing method of memory structure" was invented by Keng-Ping Lin (Taichung, Taiwan), Shu-Ming Li (Taichung, Taiwan) and Tzu-Ming Ou Yang (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a memory structure including the following steps is provided. A substrate is provided. The substrate includes a memory array region. A bit line structure is formed in the memory array region. The bit line structure is located on the substrate. A contact structure is formed in the memory array region. The contact structure is locate...