ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,495, issued on March 11, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).
"Etching method of etching apparatus" was invented by Shih-Chieh Lin (Taichung, Taiwan) and Shuen-Hsiang Ke (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An etching method of etching apparatus is disclosed. The etching apparatus performs an etching process on a material to be processed which includes a material layer and a mask layer formed on the material layer. The etching method includes the following steps. The mask layer is etched. A light intensity at a specific wavelength for light generated is detected when the etching process is perfor...