US Patent Issued to Winbond Electronics on June 17 for "Memory device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,175, issued on June 17, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Memory device and method of manufacturing the same" was invented by Cheng-Hong Wei (Taichung, Taiwan) and Chien-Hsiang Yu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device including a substrate, a plurality of stack structures, and a protective layer is provided. The plurality of stack structures are arranged along a first direction on an array area of the substrate, and each of the stack structures extends along a second direction different from the first direction. In a cross-sectional view of the memory device, each of the stack s...