US Patent Issued to Winbond Electronics on June 10 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,862, issued on June 10, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Shih-Han Hung (Taichung, Taiwan) and Feng-Jung Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a substrate, buried word line structures, a transistor structure, a first hard mask layer, hard mask marks, a second hard mask layer, and contacts. The substrate includes a first region and a second region. The buried word line structures are located in the substrate in the first region. The transistor structure is located on the substrate ...