US Patent Issued to Winbond Electronics on July 8 for "Semiconductor manufacturing apparatus and semiconductor manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,353,123, issued on July 8, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Semiconductor manufacturing apparatus and semiconductor manufacturing method thereof" was invented by Kazuhiro Segawa (Taichung, Taiwan) and Isao Tanaka (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus and a semiconductor manufacturing method thereof are provided. Wafers are grouped into a first wafer group and a second wafer group according to alignment mark position errors of the wafers and a first threshold value. The alignment mark position errors of the first wafer group are greater than the first threshol...