US Patent Issued to Winbond Electronics on July 29 for "Dynamic sampling method and device for semiconductor manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,953, issued on July 29, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Dynamic sampling method and device for semiconductor manufacture" was invented by Kazuhiro Segawa (Taichung, Taiwan) and Chiang-Sheng Liu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dynamic sampling method and device for semiconductor manufacture are provided. The dynamic sampling method includes: generating an N-dimensional virtual image of a wafer based on a design rule and at least one of a quality control data and context data; measuring a critical pattern in the N-dimensional virtual image to generate a virtual metrology result by using...