US Patent Issued to WINBOND ELECTRONICS on July 1 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,766, issued on July 1, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Hao-Chuan Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming the same are provided. A semiconductor structure includes a substrate, a bit line structure, a first conductive pillar, an interface layer, a second conductive pillar, and an intermediate structure. The substrate has an active area and an isolation structure. The bit line structure is disposed on the active area. The first conductive pillar is disposed on the activ...