ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,142, issued on Dec. 30, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).
"Three-dimensional integrated circuit" was invented by Chih-Feng Lin (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A 3-dimensional (3D) integrated circuit (IC) is provided. The 3D IC includes a plurality of chips, at least one through silicon via (TSV) structure, and a temperature sensor. The chips are stacked in the 3D IC. The TSV structure penetrates the chips. The temperature sensor is disposed in a first chip of the chips. The temperature sensor is disposed close to the TSV structure, and is configure to sense a temperature sensing result corr...