US Patent Issued to WINBOND ELECTRONICS on Aug. 26 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,361, issued on Aug. 26, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Chung-Hsien Liu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a substrate with a trench between active regions, a tunneling dielectric layer disposed on the substrate, a floating gate layer disposed on the tunneling dielectric layer, and an isolation feature disposed in the trench and on the substrate. The isolation feature has a first opening and a second opening below the first opening. The semico...