ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,689, issued on April 29, was assigned to Winbond Electronics Corp. (Taichung, Taiwan).

"Semiconductor structure" was invented by Pei-Hsiu Peng (Taichung, Taiwan) and Hung-Yu Wei (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor structure including multiple pairs of target patterns, a first conductive line, and a second conductive line. Each of the pairs of target patterns includes a top pattern and a bottom pattern. The first conductive line is disposed on a first side of the pairs of target patterns. The first conductive line is electrically connected to a top pattern of a (aN+1)th pair of target patterns i...