ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,858, issued on Sept. 30, was assigned to WIN SEMICONDUCTORS CORP. (Taoyuan, Taiwan).

"Electronic structure and method of manufacturing the same" was invented by Chia-Ta Chang (Taoyuan, Taiwan) and Po-Wei Ting (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic structure is provided. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are disposed on the substrate. The bump structure is disposed on at least one of the conductors. The protective layer is disposed on the conductors. A region is exposed between the conductors. A method of manufactur...