ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,818, issued on May 20, was assigned to WIN SEMICONDUCTORS CORP. (Taoyuan, Taiwan).
"Surface acoustic wave device" was invented by Cheng-Yao Lai (Taoyuan, Taiwan), Chia-Ta Chang (Taoyuan, Taiwan), Meng-Tse Hsu (Taoyuan, Taiwan) and Ya-Chu Yang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A surface acoustic wave (SAW) device includes: a substrate; a finger portion of an interdigital transducer (IDT) electrode disposed on the substrate; a pad portion of the interdigital transducer electrode electrically connected to the finger portion; and a wiring electrode disposed on the pad portion. The wiring electrode includes a contact metal l...