ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,481, issued on March 11, was assigned to What the Future B.V. (Amsterdam).
"Mould configuration" was invented by Edmund David Aufenast (Amsterdam).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention is directed to a mould configuration (1) suited for use in a thermoforming forming station arranged to form one or more objects comprising a mould (2) made from a polymer material by additive manufacturing and provided a mould volume (6) consisting of a recess (6a) corresponding with the shape of the object as an upper zone (6b). A lower zone is divided from the upper zone by a recess wall (8). The lower zone (7) is provided with one or more ope...