US Patent Issued to Western Digital Technologies on Oct. 7 for "Method and apparatus for substrate and spacer separation" (Malaysian Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,467, issued on Oct. 7, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Method and apparatus for substrate and spacer separation" was invented by Kok Kiong Chai (Sarawak, Malaysia), Siew Fu Chai (Sarawak, Malaysia) and Samg Yin Tang (Sarawak, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Automatic separation of substrates from spacers within a substrate/spacer stack or laminate for use during a hard disk recording media fabrication process. In one example, a delamination apparatus includes a roller or brush configured to rotate while pressing against a flat surface of a substrate at one end of the laminate to peel the ...