US Patent Issued to Western Digital Technologies on Oct. 21 for "Reduction of high tape contact pressure points against head assembly" (American, Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,157, issued on Oct. 21, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Reduction of high tape contact pressure points against head assembly" was invented by Oscar J. Ruiz (San Jose, Calif.), Kenji Kuroki (Fujisawa, Japan) and Eduardo Torres Mireles (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to a head assembly in a data storage device. The data storage device may include magnetic media embedded in the device or magnetic media from an insertable cassette or cartridge (e.g., in an LTO drive), where the head assembly reads from and writes to the magnetic media. During...