US Patent Issued to Western Digital Technologies on June 3 for "Semiconductor device package with combined contacts" (Philippine, Malaysian Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,689, issued on June 3, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Semiconductor device package with combined contacts" was invented by Uthayarajan Rasalingam (Penang, Malaysia) and Roel Gabriel Hernando Taburnal (San Jose del Monte, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a substrate having a top and bottom surface and an electrical circuit. There is a semiconductor die electrically connected to the electrical circuit of the substrate. There are N adjacent first electrical contacts and N is an integer greater than 1. The N adjacent first electrical contacts are pos...