US Patent Issued to Western Digital Technologies on July 1 for "Semiconductor device package die stacking system and method" (Chinese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,810, issued on July 1, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Semiconductor device package die stacking system and method" was invented by Yazhou Zhang (Shanghai), Jiandi Du (Shanghai) and Hope Chiu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory device includes first memory dies stacked one upon another and electrically connected one to another by first bond wires, and covered with a first encapsulant. Second memory dies are disposed above the first memory dies, stacked one upon another and electrically connected one to another with second bond wires, and covered with a second encapsula...