ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,552, issued on Jan. 13, was assigned to WAVEPIA Co. LTD. (Gyeonggi-do, South Korea).
"Radio frequency chip package" was invented by Sang-Hun Lee (Gyeonggi-do, South Korea), Sang-Yeol Lee (Gyeonggi-do, South Korea) and Sang-Soo Kim (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency (RF) chip package includes: an RF die; a first peripheral circuit chip; a second peripheral circuit chip; a substrate having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of th...