US Patent Issued to WALTON ADVANCED ENGINEERING on Nov. 25 for "Chip package with higher bearing capacity in wire bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,771, issued on Nov. 25, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan).

"Chip package with higher bearing capacity in wire bonding" was invented by Hong-Chi Yu (Kaohsiung, Taiwan), Chun-Jung Lin (Kaohsiung, Taiwan) and Ruei-Ting Gu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package with higher bearing capacity in wire bonding is provided. The chip package includes at least one conductive circuit which is a structure with a thickness ranging from 4.5 micro metre to 20 micro metre. Thereby a structural strength of the conductive circuit is improved and able to stand a positive pressure generated in w...