ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,448, issued on Dec. 30, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan).
"Multi-layer stacked chip package" was invented by Hong-Chi Yu (Kaohsiung, Taiwan), Chun-Jung Lin (Kaohsiung, Taiwan) and Ruei-Ting Gu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer stacked chip package is provided. A first substrate, a first circuit layer, a first chip, and a first insulation layer form a lower layer chip package while a second substrate, a second circuit layer, a second chip, and a second insulation layer form an upper layer chip package. The upper layer chip package is stacked over the lower layer chip pa...