ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,241, issued on May 13, was assigned to Wacom Co. Ltd. (Saitama, Japan).
"Wire mesh sensor and shape evaluating method" was invented by Jun Kadowaki (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wire mesh sensor including one or more wire meshes provided in a planar shape. Each of the one or more wire meshes includes a plurality of effective elements forming a band-shaped electrode extending in one direction by a combination of a plurality of line elements or a plurality of point elements, and a plurality of dummy elements isolated from the effective elements. At least the effective elements have a pattern shape that is...