ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,049, issued on May 20, was assigned to VITESCO TECHNOLOGIES GMBH (Regensburg, Germany).
"High temperature sensor housing with thermocouple connectors, and method for manufacturing the same" was invented by Otakar Miksanek (Munich), Tomas Buzek (Munich), Ales Filipec (Munich) and Petr Marecek (Munich).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the teachings herein include a connector assembly comprising: a housing; a connector housing integrally formed as part of the housing; an aperture integrally formed as part of the connector housing; a wire assembly including a wire connector having a housing portion located in the aper...