ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,128, issued on Nov. 11, was assigned to VIAVI SOLUTIONS SUZHOU Co. LTD. (Suzhou, China).
"Wafer manufacturing apparatus" was invented by Ailing Ding (Shanghai), Weibin Huang (Kunshan, China), Yinxiang Xia (Suzhou, China) and Markus K. Tilsch (Santa Rosa, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compressio...