ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,987, issued on Feb. 10, was assigned to VIAVI Solutions Inc. (Chandler, Ariz.).

"Reactive sputter deposition of dielectric films" was invented by Georg J. Ockenfuss (Santa Rosa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without inc...