US Patent Issued to VIAVI SOLUTIONS on April 22 for "Blind scan for multi-carriers and multi-technologies and seamless signal analysis" (South Korean, American Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,101, issued on April 22, was assigned to VIAVI SOLUTIONS INC. (Chandler, Ariz.).

"Blind scan for multi-carriers and multi-technologies and seamless signal analysis" was invented by Wei Chen (Potomac, Md.), Nick Ghaemi (Germantown, Md.), Hyuck-In Kwon (Seoul, South Korea) and Jin-Ook Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test device for performing a bling scan includes a digital blind scan circuit. The blind scan circuit includes digital detectors for multiple cellular technologies that simultaneously perform correlation in a baseband frequency range to detect whether received RF signals include a channel of the tech...