US Patent Issued to VIASAT on May 6 for "Semiconductor package inspection with predictive model for wirebond radio frequency performance" (Arizona, California Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,504, issued on May 6, was assigned to VIASAT INC. (Carlsbad, Calif.).

"Semiconductor package inspection with predictive model for wirebond radio frequency performance" was invented by Ian A. Cleary (Phoenix) and Timothy M. Beck (San Marcos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems and devices for use in semiconductor package manufacture of a package having a die and die substrate are provided. A method for use in semiconductor package manufacture includes steps of forming one or more wirebond interconnections between the die and the die substrate, capturing input data representative of wirebond interconnection features ...