US Patent Issued to ViaCyte on May 13 for "3-dimensional large capacity cell encapsulation device assembly" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,125, issued on May 13, was assigned to ViaCyte Inc. (San Diego).

"3-dimensional large capacity cell encapsulation device assembly" was invented by Vincent So (San Diego), Laura Martinson (San Diego), Chad Green (San Diego), Michael Scott (San Diego) and Mario Zamarripa (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are implantable 3-dimensional large capacity device assemblies, specifically, large capacity device assemblies for encapsulating pancreatic progenitor cells for treatment of diabetes."

The patent was filed on July 28, 2021, under Application No. 17/387,855.

*For further information, including images, charts a...