ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,552, issued on Dec. 16, was assigned to VIA MECHANICS LTD. (Kanagawa, Japan).
"Method of processing substrate" was invented by Yasushi Ito (Atsugi, Japan) and Takumi Osanai (Atsugi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the ar...