ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,947, issued on July 8, was assigned to VIA LABS INC. (New Taipei, Taiwan).
"Multilayer-type on-chip inductor structure" was invented by Sheng-Yuan Lee (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric (IMD) layer, and first and second winding portions symmetrically arranged in the IMD layer and the insulating redistribution layer with respect to a symmetrical axis. The first and second winding portions each includes at least first and second semi-circular stacking layers arranged from the in...