ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,815, issued on April 22, was assigned to VIA LABS INC. (New Taipei, Taiwan).
"Multilayer-type on-chip inductor structure" was invented by Sheng-Yuan Lee (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer-type on-chip inductor includes a first winding portion arranged in an inter-metal dielectric (IMD) layer, which includes first and second semi-circular stacking layers arranged from inside to outside and in concentricity. A second winding portion includes third and fourth semi-circular stacking layers arranged symmetrically with the first semi-circular stacking layer and the second semi-circular stacking layer, respective...