US Patent Issued to Versum Materials US on Oct. 7 for "Compositions and methods using same for non-conformal deposition of silicon containing films" (American, Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,416, issued on Oct. 7, was assigned to Versum Materials US LLC (Tempe, Ariz.).

"Compositions and methods using same for non-conformal deposition of silicon containing films" was invented by Meiliang Wang (Shanghai), Tingmin Wang (Tempe, Ariz.) and Xinjian Lei (Vista, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An atomic layer deposition method for depositing a non-conformal silicon and oxygen containing film into surface features comprising vias and/or trenches on one or more substrates."

The patent was filed on Sept. 4, 2020, under Application No. 17/641,156.

*For further information, including images, charts and tables, please visit: ht...