US Patent Issued to VERSIV COMPOSITES on March 25 for "Copper-clad laminate and method of forming the same" (Massachusetts, New Hampshire Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,468, issued on March 25, was assigned to VERSIV COMPOSITES Ltd. (Kilrush, Ireland).

"Copper-clad laminate and method of forming the same" was invented by Jennifer Adamchuk (Marlborough, Mass.), Gerard T. Buss (Bedford, N.H.) and Theresa M. Besozzi (Milford, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an...