US Patent Issued to VERSIV COMPOSITES on Aug. 19 for "Dielectric substrate and method of forming the same" (American, British Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,850, issued on Aug. 19, was assigned to VERSIV COMPOSITES Ltd. (Kilrush, Ireland).

"Dielectric substrate and method of forming the same" was invented by Jennifer Adamchuk (Marlborough, Mass.), Dale Thomas (Rochdale, Great Britain), Meghann White (Bedford, N.H.), Sethumadhavan Ravichandran (Shrewsbury, Mass.) and Gerard T. Buss (Bedford, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled...