US Patent Issued to VERMON on June 17 for "Flexible printed circuit board device for interfacing high density ultrasound matrix array transducer with integrated circuits" (French Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,329,576, issued on June 17, was assigned to VERMON SA (Tours, France).

"Flexible printed circuit board device for interfacing high density ultrasound matrix array transducer with integrated circuits" was invented by Guillaume Ferin (Truyes, France) and Philippe Vince (Truyes, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed circuit board includes a central portion and one or more tabs extending from the central portion. The one or more tabs are foldable relative to the central portion. A plurality of pads are located within the central portion, and the plurality of pads are configured to electrically connect to a transducer. Land...