US Patent Issued to Verily Life Sciences on Dec. 2 for "Thin-film high-density sensing array, sub-scalp implantation tool and implant method" (California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,484,829, issued on Dec. 2, was assigned to Verily Life Sciences LLC (Dallas).

"Thin-film high-density sensing array, sub-scalp implantation tool and implant method" was invented by Shivkumar Sabesan (Campbell, Calif.) and Benjamin Yaffe (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices, systems and techniques are provided to facilitate chronic monitoring of biological signals. An implant device can include a set of branch portions. Each branch portion can include multiple electrodes disposed on a bottom surface and can have vias that connect the electrode to a trace on the top of the branch portion. Each branch portion can include a h...