US Patent Issued to Ventana Micro Systems on Nov. 25 for "Method and apparatus for deskewing die to die communication between system on chip devices" (California, Texas Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,310, issued on Nov. 25, was assigned to Ventana Micro Systems Inc. (Cupertino, Calif.).

"Method and apparatus for deskewing die to die communication between system on chip devices" was invented by David A. Kruckemyer (San Francisco), John G. Favor (San Francisco) and Kelvin D. Goveas (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die-to-die (D2D) interface between chiplets of a system on a chip (SoC) in which each of the chiplets are subdivided into slices. The D2D interface includes a transmission interface coupled between first and second chiplets, which includes a first transmission path for a first slice and a second transmissio...