US Patent Issued to VAST GLORY ELECTRONICS & HARDWARE & PLASTIC (HUI ZHOU) on July 22 for "Three-dimensional heat transfer device" (Chinese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,366,419, issued on July 22, was assigned to VAST GLORY ELECTRONICS & HARDWARE & PLASTIC (HUI ZHOU) LTD. (Hui Zhou, China).

"Three-dimensional heat transfer device" was invented by Xue Mei Wang (Hui Zhou, China) and Zhijie Yang (Hui Zhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber."

The patent was filed ...