US Patent Issued to Vanguard International Semiconductor on Feb. 25 for "Method of forming micro-electromechanical system device" (Singaporean Inventor)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,239,024, issued on Feb. 25, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Method of forming micro-electromechanical system device" was invented by Jia Jie Xia (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming micro-electromechanical system (MEMS) device, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semicondu...