US Patent Issued to Vanguard International Semiconductor on Aug. 26 for "Structure of transferring dies for use in mass transferring process" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,883, issued on Aug. 26, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Structure of transferring dies for use in mass transferring process" was invented by Yung-Hsiang Chen (Hsinchu, Taiwan), Yun-Chou Wei (Taipei, Taiwan), Ke-Fang Hsu (Hsinchu County, Taiwan), Ching-Yi Hsu (Hsinchu, Taiwan) and Yen-Shih Ho (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure of transferring dies includes an oxide layer supporting feature, multiple dies, a bonding feature, a supporting wafer, and a spacer. The oxide layer supporting feature includes multiple repeating units. Each repeating unit has a die setting ...