US Patent Issued to UTAC Headquarters on May 6 for "Semiconductor device and method of forming leadframe with clip bond for electrical interconnect" (Thai Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,972, issued on May 6, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Semiconductor device and method of forming leadframe with clip bond for electrical interconnect" was invented by Natawat Kasikornrungroj (Bangkok), Phongsak Sawasdee (Bangkok) and Wannasat Panphrom (Bangkok).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a leadframe and a first electrical component including a first surface disposed on the leadframe. A first clip bond is disposed over a second surface of the first electrical component. The first clip bond extends vertically through the semiconductor device. The first clip bond has a vertical mem...