US Patent Issued to UTAC Headquarters on May 13 for "Semiconductor device and method of forming an optical semiconductor package with a shield structure" (Singaporean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,657, issued on May 13, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Semiconductor device and method of forming an optical semiconductor package with a shield structure" was invented by Emmanuel Espiritu (Singapore), Il Kwon Shim (Singapore), Jeffrey Punzalan (Singapore) and Teddy Joaquin Carreon (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the...