US Patent Issued to UTAC Headquarters on Dec. 2 for "Semiconductor device and method of disposing electrical components above and below substrate" (Thai Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,078, issued on Dec. 2, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Semiconductor device and method of disposing electrical components above and below substrate" was invented by Krit Pajuvang (Bangkok) and Siriwanna Ounkaew (Bangkok).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate with a die mounting site and a plurality of leads. A first electrical component is disposed over a first surface of the die mounting site. A second electrical component is disposed over a second surface of the die mounting site opposite the first surface of the die mounting site. A first bond wire is coupled between the firs...